EKL PCGH Brocken 2


Fan Diameter:140 mm, Power Connector:3 pin Molex connector, Rotation Speed:700 rpm, Heatsink Dimensions:165 mm x 146 mm x 121.5 mm, Compatible With:LGA775 Socket, LGA1156 Socket, Socket AM2, Socket AM2+, Socket AM3, LGA1155 Socket, Socket AM3+, LGA2011 Socket, Socket FM1, Socket FM2, LGA1150 Socket, LGA2011-3 Socket, LGA1151 Socket, Operation Voltage:7 – 12 V, Air Flow:35 cfm, Fan Height:26 mm, Heatsink Material:Aluminium, Rated Voltage:12 V, Features:Heat-pipe Direct Touch (H.D.T.) Technology, 5 copper heatpipes (6 mm), Heat-pipe Direct Contact (HDC) technology, Wing Boost2 Technology, RockMount mounting system, Noise Level:18.5 dBA, Power Consumption:0.36 W, Fans Qty:2, Mounting Kit:Included, Features:Asymmetrical design, MTBF:40,000 hour(s)

Width:14.6 cm
Depth:12.15 cm
Height:16.5 cm
Package Content:Thermal paste, mounting bracket
Weight:985 g

£46.01

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Fan Diameter:140 mm, Power Connector:3 pin Molex connector, Rotation Speed:700 rpm, Heatsink Dimensions:165 mm x 146 mm x 121.5 mm, Compatible With:LGA775 Socket, LGA1156 Socket, Socket AM2, Socket AM2+, Socket AM3, LGA1155 Socket, Socket AM3+, LGA2011 Socket, Socket FM1, Socket FM2, LGA1150 Socket, LGA2011-3 Socket, LGA1151 Socket, Operation Voltage:7 – 12 V, Air Flow:35 cfm, Fan Height:26 mm, Heatsink Material:Aluminium, Rated Voltage:12 V, Features:Heat-pipe Direct Touch (H.D.T.) Technology, 5 copper heatpipes (6 mm), Heat-pipe Direct Contact (HDC) technology, Wing Boost2 Technology, RockMount mounting system, Noise Level:18.5 dBA, Power Consumption:0.36 W, Fans Qty:2, Mounting Kit:Included, Features:Asymmetrical design, MTBF:40,000 hour(s)

Width:14.6 cm
Depth:12.15 cm
Height:16.5 cm
Package Content:Thermal paste, mounting bracket
Weight:985 g



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